Huawei allegedly working on HiSilicon Kirin 710 with 12nm fabrication
“The Kirin 710 appears to be a mid-range chipset with Cortex-A73 cores”
If you haven’t been living under a rock lately, you might not know that Qualcomm recently launched a new 7XX series of chipset with the launch of Snapdragon 710. The recently launched Xiaomi Mi 8 SE is the world’s first smartphone to come equipped with the latest chipset. Now, it seems that rival Chinese brand, Huawei is working on a contending chipset called HiSilicon Kirin 710.
The newest HiSilicon Kirin 710 is a mid-range processor which comes as an upgrade to the Kirin 659 chipset. Reports suggest that the newest chipset from the brand will come with Cortex-A73 cores and is being manufactured using a 12nm fabrication process. Furthermore, just like the top-end Kirin 970 processor from the brand, the Kirin 710 is also expected to come with a built-in Neural Processing Unit (NPU) to facilitate AI functionalities across the board. In comparison, the Snapdragon 710 comes with 10nm die size and a multi-core AI engine.
According to the sources, Huawei is working on a series of smartphones powered by the latest chipset to rival the Snapdragon 710-powered handset. The first smartphone to come powered by the HiSilicon Kirin 710 is expected to be the Huawei Nova 3. This handset is speculated to come with a 19.5:9 all-screen display and dual camera module. It is expected to launch in the month of July. Huawei also has two new smartphones with model numbers PRA-AL00 and PRA-TL00, which have recently been spotted on 3C certification.
The report also speculates that Huawei is expected to ship more than140 million smartphones in 2018, half of which are expected to be mid-range phones. We will bring you more updates as and when they emerge, so stay tuned.
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